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Package information - SOT323
Surface mounted, 3 pin package Package outline
b e e Q1 L
E
E1
e1 D C A A2
A1
Dim. A A1 A2 b C D E
Millimeters Min. 0.80 0 0.80 0.25 0.10 1.80 1.80 Max. 1.10 0.10 1.00 0.40 0.26 2.20 2.40
Inches Min. 0.0315 0 0.0315 0.0098 0.0039 0.0709 0.0709 Max. 0.0433 0.0039 0.394 0.0158 0.0102 0.0866 0.0945
Dim. E1 e e1 L Q1 -
Millimeters Min. 1.15 Max. 1.35
Inches Max. 0.0453 Max. 0.0532
0.65 BSC 1.30 BSC 0.10 0.10 0 0.30 0.40 30 -
0.0256 BSC 0.0512 BSC 0.0039 0.0039 0 0.0118 0.0158 30 -
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
0.8 0.031
0.65 0.025
0.6 0.024
1.6 0.063
mm inches
Issue 2 - March 2007
(c) Zetex Semiconductors plc 2007
1
www.zetex.com
Package information - SOT323
Nominal weight
Nominal weight per device 5.45mg.
Tape and reel information
Orientation Tape width (mm) 8 8 Reel size (inches) 7 13 No. of components 3,000 10,000 Tape option indicator TA TC
Embossed carrier tape configuration
P0 K t
Top cover tape 10 pitches culmulative tolerance on tape 0.2mm (0.008")
D
P2
E
See Note 1
A0
See Note 1
F
W
B1
K0
See Note 1
B0 P
Embossment Center lines of cavity
D1
User direction of feed
Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P
Tape size (mm) 8 See note
*
12 See note
*
16 See note
*
24 See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 11.50 0.10 (0.453 0.004) 4.00 0.10 (0.157 0.004) to 20.00 0.10 (0.787 0.004) in 4.00 (0.157) increments 4.00 0.10 2.00 0.05 0.40 24.30 (0.957)
4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 0.10 3.50 0.10 (0.138 0.004) 4.00 0.10 (0.157 0.004)
8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 5.50 0.05 (0.217 0.002) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004)
12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 2.00 0.05 0.40 16.30 (0.642)
P0 P2 t (max.) W
4.00 0.10 2.00 0.05 0.40 8.00 (0.315)
4.00 0.10 2.00 0.05 0.40 12.00 0.30 (0.472 0.012)
NOTES: * A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1).
Issue 2 - March 2007
(c) Zetex Semiconductors plc 2007
2
www.zetex.com
Package information - SOT323
0.5mm maximum 20 maximum Component cavity center line
0.5mm maximum 20 maximum
B0
Component center line A0
Sketch A (top view) Component lateral movement
Sketch B (side or front sectional view) Component rotation - side view
Sketch C (top view) Component rotation - top view
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth
T
B
A
D
N
C
Full radius
G
Tape option TA TC
A max. 179 (7.047) 330 (12.992)
B min. 1.5 (0.06) G
C 13.00 - 13.02 (0.512 - 0.52)
D min. 25.0 (0.984) 20.2 (0.795) T max.
N min. 50 (1.969)
Tape size 8mm 12mm 16mm 24mm
8.4 -9.9 (0.33 - 0.39) 12.4 -16.4 (0.49 - 0.569) 16.4 -18.4 (0.65 - 0.729 ) 24.4 - 26.4 (0.96 - 1.039)
14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 2 - March 2007
(c) Zetex Semiconductors plc 2007
3
www.zetex.com

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